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Silicones from Dow Corning
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IMAGINE: No shocks, no shorts, no stress

No shocks, no shorts, no stressAs electronics are used in increasingly harsh environments, it’s becoming more critical than ever to protect sensitive components against thermal and mechanical stress.

Dow Corning’s high-performing silicone die encapsulants help protect your high-value microelectronics in demanding automotive, communications, and consumer electronics applications. Formulated to flow evenly, quickly and without leaving air gaps around complex chip architectures, these high-purity materials deliver low ionic content, as well as low moisture to protect against corrosion of copper or aluminum contacts.

Our line of silicone die encapsulants exhibit minimal shrinkage during processing to reduce component stress versus organic materials. After cure, their low modulus further protects delicate wires against mechanical stress caused by thermal expansion. Compatible with commonly used dispensing, printing and liquid injection molding techniques, Dow Corning® die encapsulants maintain reliable performance even at the high reflow temperatures required for lead-free processing.

As a leading supplier of silicones for more than seven decades, Dow Corning has an established record for delivering targeted properties consistently, with batch-to-batch reproducibility and backed by certified data and 24/7 global technical support. Count on us for a host of analytical and technical services ranging from material qualification and testing through manufacturing start-up and equipment recommendations. Our extensive knowledge of materials and processes can often translate into manufacturing and process efficiencies for you.

More than a world-class materials supplier, Dow Corning is an expert and dedicated collaborator. If our product finder cannot identify an off-the-shelf solution that meets your precise specifications, or if you are looking for application expertise and support please contact us.

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High-purity silicones for semiconductor assembly and packaging
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